ALLTEMATED

Since 1993, Alltemated Inc. has led the Electronic Manufacturing industry with value-added services and our PLACE-N-BOND Underfilm Adhesive. We provide Tape and Reel, IC Programming, Laser Marking, Lead Trim/Form, and other assembly services, plus standard and custom carrier tapes. ISO 9001:2015 and Chicago-based, we offer unique underfilm technology that eliminates dispensing and curing underfills and enhances components’ mechanical strength to their substrate. Originally invented for corner-edge bonding of BGA/CSP/LGA packages, it has expanded to a variety of additional applications.