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Manufacturing
Adhesion & Bonding Expo - Osaka
International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...
Dates
May 12, 2027
– May 14, 2027
This event will take place. Starts in 178 days.
Location
Ōsaka, Japan
International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...
Dates & Locations
May 12, 2027
– May 14, 2027
Event Information
Website: https://www.material-expo.jp/hub/en-gb/about/joi.html
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